rn 3M™ Wafer De-Taping Tape 879
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rn Part Number 879, 3M ID EMMDM2WaferDetapingTape879
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- rn Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding rn
- rn Transparency allows for inspection without tape removal rn
- rn High instant adhesion to substrate rn
- rn Good holding power rn
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rn rn Specifications
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rnrn Details
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- rn Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding rn
- rn Transparency allows for inspection without tape removal rn
- rn High instant adhesion to substrate rn
- rn Good holding power rn
rn 3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
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