3M™ Wafer De-Taping Tape 3305

3M™WaferDe-TapingTape3305PartNumber3305,3MIDEMMDM2WaferDetapingTape3305Enablessimple,low-stress,roomtemperaturepeelingof3M™AdhesivesfromthinnedsiliconwafersafterglasscarrierdebondingTransp

rn 3M™ Wafer De-Taping Tape 3305

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rn Part Number 33053M ID EMMDM2WaferDetapingTape3305

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  • rn Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
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  • rn Transparency allows for inspection without tape removal
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  • rn High instant adhesion to substrate
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  • rn Good holding power
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