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rn rn 3M TC-2810 Thermally Conductive Epoxy Adhesive 37 mL Duo-Pak Cartridge
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rn rn rn Data Sheet
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3M™ Thermal Management Solutions For Electronics Brochure PDF (PDF, 1.4MB)(点击下载)
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rn Article Reprint
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EPT Article Reprint - EMI (PDF, 2.4MB)
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ECN Reprint on Thermal Management "No more Silos...." (PDF, 199.5KB)
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Assembly Magazine June 2004 "Beat the Heat" (PDF, 113.2KB)
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rn rnrnrnrnrnrn Flyer
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Thermal Management Solutions for LED Assembly (PDF, 208.7KB)
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rn Part#:TC-2810 37ML DUO PAK
rn rn 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride(BN) filler for good thermal conductivity with high adhesion.
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rn rn Features and Benefitsrn
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- rn High adhesive strength rn
- rn Slight tack allows pre-assembly rn
- rn Good surface wet out rn
- rn Low viscosity for potting application rn
- rn Good gap filling rn
- rn Thin bonding line rn
- rn Good thermal conductivity (1.0-1.4 W/m-K) rn
- rn Low CL ion content and outgassing rn
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rn rn Description:
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rn rn Sold as a pack (12/pk). 3M Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. 37 mL Duo-Pak Cartridge.
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rnrn Product Attributes
rnrn Application | rnrn Battery Thermal Management, Heatsink-Thermal Interface Attachment, Heatsink-Thermal Interface-Non Bonding, IC Packaging Heat Conduction, LED Lighting Thermal Management, Thermal Material Potting | rn
rn Application Category | rnrn Thermal Interface Materials | rn
rn Color | rnrn Cream | rn
rn Dielectric Strength | rnrn 3.0 kV/mm | rn
rn Full Cure Schedule | rnrn 23 Degree C/24 hours, 50 Degree C/270 minutes, 70 Degree C/90 minutes, 90 Degree C/30 minutes, 120 D | rn
rn Glass Transition Temperature (Tg) | rnrn 60 Degree C (when cured at RT for 24hrs) | rn
rn Operating Temperature Range (Celsius) Long Term | rnrn (Weeks-Months) 80 to 100 Degree C | rn
rn Operating Temperature Range (Celsius) Short Term | rnrn (Hours-Days) 125 to 140 Degree C | rn
rn Product Series | rnrn TC-2810 | rn
rn Thermal Coefficient of Expansion | rnrn 62 ppm/Degree C (below Tg), 205 ppm/Degree C (above Tg) | rn
rn Thermal Conductivity | rnrn 0.8-1.4 W/m-K | rn
rn Thermal Impedance | rnrn 0.05 (Degree C)-in^2/W (with thickness 50um) | rn
rn Thermal Impedance (metric) | rnrn 0.32 (Degree C)-cm^2/W (with thickness 50um) | rn
rn Viscosity | rnrn Mixed 40,000 ~ 800,000 cps | rn
rn Worklife Time and Temperature | rnrn 60 minutes at 72 Degree F (23 Degree C) | rn
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