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3M™ Anisotropic Conductive Film 5363

3M™ Anisotropic Conductive Film 5363

3M™AnisotropicConductiveFilm5363PartNumber5363,3MIDEMMDM2ACF5363HeatcureFastbondtimeThermo-sethightemperaturecureExcellentchemicalresistanceViewalldetailsSpecificationsAdhesiveThickness(metric)4

rn 3M™ Anisotropic Conductive Film 5363

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rn Part Number 5363, 3M ID EMMDM2ACF5363

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  • rn Heat cure
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  • rn Fast bond time
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  • rn Thermo-set high temperature cure
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  • rn Excellent chemical resistance
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rn View all details
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rn Specifications
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    rn Adhesive Thickness (metric)
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    rn 40 micron
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    rn Adhesive Type
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    rn Thermoset Epoxy
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    rn Application Category
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    rn Bonding
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    rn Applications
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    rn Electronic Component Bonding, Flex Bonding
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    rn Bonding Method
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    rn Thermo-compression bonding
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    rn Bonding Pressure
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    rn 3 - 5 MPa
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    rn Bonding Temperature
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    rn 190 - 210 Degree C
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    rn Bonding Time
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    rn 10 seconds
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    rn Conductive Particle Size
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    rn 10 micron
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    rn Conductive Particle Type
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    rn Gold-coated Ni
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    rn Connection Type
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    rn Flex to Flex, Flex to PCB
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    rn Flex Type
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    rn Gold/Copper on Polyimide
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    rn Liner Thickness (metric)
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    rn 50 Micron
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    rn Liner Type
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    rn Polyester Film with Silicone Release
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    rn Minimum Gap
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    rn 4 mil
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    rn Minimum Gap (metric)
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    rn 100 Micron
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    rn Minimum Overlap Area
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    rn 0.15 mm²
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    rn Minimum Pitch
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    rn 8 mil
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    rn Minimum Pitch (metric)
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    rn 200 Micron
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    rn Product Form
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    rn Roll
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    rn Product Series
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    rn 5363
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    rn Shelf Life
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    rn 4 Weeks
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    rn Shelf Life Frozen
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    rn 15 Month
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    rn Standard Width (metric)
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    rn 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm
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    rn Tacking Pressure
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    rn 0.1 - 1.5 MPa
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    rn Tacking Temperature
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    rn 90 - 110 degree C
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    rn Tacking Time
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    rn 1 - 2 seconds
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    rn Total Trace Height (metric)
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    rn 75 Micron
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rn Details
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  • rn Heat cure
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  • rn Fast bond time
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  • rn Thermo-set high temperature cure
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  • rn Excellent chemical resistance
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  • rn Highest thermal stability
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  • rn Replaces solder for lead-free solution
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  • rn Frozen storage
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rn 3M™ ACF 5363 is an epoxy-based adhesive system with 10 micron gold-coated Ni particles. It is a heat-bondable, electrically-conductive adhesive film with excellent reliability.

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rn Additional Information
rn Thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Hard conductive particles are preferred for copper traces, as they embed into traces for good electrical performance. 3M™ ACF 5363 may be used to bond a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

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