- rn Heat curern
- rn Fast bond timern
- rn Thermo-set high temperature curern
- rn Excellent chemical resistancern
- rn Highest thermal stabilityrn
- rn Replaces solder for lead-free solutionrn
- rn Frozen storagern
rn 3M™ ACF 5363 is an epoxy-based adhesive system with 10 micron gold-coated Ni particles. It is a heat-bondable, electrically-conductive adhesive film with excellent reliability.
rn Additional Information
rn Thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Hard conductive particles are preferred for copper traces, as they embed into traces for good electrical performance. 3M™ ACF 5363 may be used to bond a flexible printed circuit to another flexible printed circuit or to a printed circuit board.