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3M™ Thermal Bonding Film 583

3M™ Thermal Bonding Film 583

3M™ThermalBondingFilm583PartNumber583,3MIDEMMDM2ThermalBondingFilm583FlexibleHeatorsolventactivationCanbedie-cutSlightsurfacetackViewalldetailsSpecificationsAdhesiveThickness2.0milAdhesiveThickn

rn 3M™ Thermal Bonding Film 583

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rn 图片关键词

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rn Part Number 583, 3M ID EMMDM2ThermalBondingFilm583

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  • rn Flexible
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  • rn Heat or solvent activation
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  • rn Can be die-cut
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  • rn Slight surface tack
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rn View all details
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rn Specifications
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    rn Adhesive Thickness
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    rn 2.0 mil
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    rn Adhesive Thickness (metric)
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    rn 0.05 mm
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    rn Adhesive Type
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    rn Thermoset
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    rn Application Category
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    rn Bonding
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    rn Applications
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    rn Bezel Bonding, Case Assembly, Flex Bonding, Flex Stiffener Bonding, Glass Cloth Splicing for PCB, Low Surface Energy Bonding
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    rn Base Material
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    rn Nitrile Phenolic
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    rn Bond Cure Time
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    rn 5 Minutes
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    rn Bondline Temp (Celsius)
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    rn 121 degree C
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    rn Bondline Temp (Fahrenheit)
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    rn 250 degree F
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    rn Bond Type
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    rn Permanent
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    rn Brand
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    rn 3M
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    rn Elongation
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    rn 800% (Before Crosslinking)
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    rn Face-Side Liner Thickness
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    rn 3 mil
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    rn Face-Side Liner Thickness (Metric)
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    rn 0.08 mm
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    rn Face-Side Liner Type
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    rn Silicone Paper
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    rn Film Color
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    rn Brown
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    rn Maximum Width Available
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    rn 48 Inch
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    rn Maximum Width Available (metric)
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    rn 1200 mm
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    rn Product Form
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    rn Roll
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    rn Product Series
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    rn 583
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    rn Substrates
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    rn Aluminum, FR-4, Steel (Cold Rolled, Stainless)
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rn Details
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  • rn Flexible
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  • rn Heat or solvent activation
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  • rn Can be die-cut
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  • rn Slight surface tack
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  • rn Heat crosslinkable option
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  • rn Lower temperature lamination of the nitrile phenolic film range
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rn 3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

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rn Additional Information
rn This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.

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