rn 3M™ Thermal Bonding Film 583
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rn Part Number 583, 3M ID EMMDM2ThermalBondingFilm583
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- rn Flexible rn
- rn Heat or solvent activation rn
- rn Can be die-cut rn
- rn Slight surface tack rn
rn View all details
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rn rn Specifications
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rnrn Details
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- rn Flexible rn
- rn Heat or solvent activation rn
- rn Can be die-cut rn
- rn Slight surface tack rn
- rn Heat crosslinkable option rn
- rn Lower temperature lamination of the nitrile phenolic film range rn
rn 3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
rnrn Additional Information
rn This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
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