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3M™ Wafer De-Taping Tape 3305

3M™ Wafer De-Taping Tape 3305

3M™WaferDe-TapingTape3305PartNumber3305,3MIDEMMDM2WaferDetapingTape3305Enablessimple,low-stress,roomtemperaturepeelingof3M™AdhesivesfromthinnedsiliconwafersafterglasscarrierdebondingTransp

rn 3M™ Wafer De-Taping Tape 3305

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rn 图片关键词

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rn Part Number 3305, 3M ID EMMDM2WaferDetapingTape3305

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  • rn Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
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  • rn Transparency allows for inspection without tape removal
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  • rn High instant adhesion to substrate
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  • rn Good holding power
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rn View all details
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rn Specifications
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    rn Adhesion to Ethyl Vinyl Acetate
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    rn 56 oz./in. width (61 N/100 mm)
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    rn Adhesion to SS
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    rn 120 oz./in. width (131 N/100 mm)
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    rn Adhesive Type
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    rn Rubber
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    rn Applications
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    rn Wafer De-Taping
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    rn Backing
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    rn Polyester Film
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    rn Elongation at Break
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    rn 177%
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    rn Product Series
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    rn 3305
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    rn Tape Thickness
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    rn 2.7 mil
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    rn Tensile Strength at Break
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    rn 78.4 Kilogram per Centimetre
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rn Details
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  • rn Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
    • rn
  • rn Transparency allows for inspection without tape removal
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  • rn High instant adhesion to substrate
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  • rn Good holding power
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rn 3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

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