rn 3M™ Anisotropic Conductive Film 7303
rnrn 
rn Part Number 7303, 3M ID EMMDM2ACF7303
rnrn
rn- rn
- rn Heat cure rn
- rn Thermo-set low temperature cure rn
- rn Tacky at room temperature rn
- rn Good thermal stability rn
- rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn rn
- rn
- rn Heat cure rn
- rn Thermo-set low temperature cure rn
- rn Tacky at room temperature rn
- rn Good thermal stability rn
- rn Reworkable rn
- rn Frozen storage rn
rn 3M™ ACF 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.
rnrn Additional Information
rn The unbonded film is slightly tacky at room temperature and consists of a thermosetting epoxy/acrylate adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Hard conductive particles are preferred for copper traces, as they embed into traces for good electrical performance. 3M™ ACF 7303 may be used to bond a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
rn
rn